Details, datasheet, quote on part number: SN74HC574DW
PartSN74HC574DW
CategorySemiconductors => Logic => Flip-Flop/Latch/Register => D-Type Flip-Flop
Part familySN74HC574 Octal Edge-Triggered D-Type Flip-Flops With 3-State Outputs
TitleD-Type (3-State) Flip-Flops
DescriptionOctal Edge-Triggered D-Type Flip-Flops With 3-State Outputs 20-SOIC -40 to 85
CompanyTexas Instruments, Inc.
StatusACTIVE
ROHSY
SampleNo
DatasheetDownload SN74HC574DW datasheet
Cross ref.Similar parts: MC74HC574ADW, MC74HC574ADWR2, MC74HC574DW, MC74HC574DWR2, MC74HC374ADW, HD74HC374RP, HD74HC564RP, HD74HC574RP, HD74HC574RP-EL, MM74HC574WM
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Specifications 
3-State OutputYes
Voltage(Nom)(V)3.3,5
Bits(#)8
ICC @ Nom Voltage(Max)(mA)0.08
F @ Nom Voltage(Max)(Mhz)28
Operating Temperature Range(C)-40 to 85
Technology FamilyHC
Package GroupPDIP,SO,SOIC,SSOP,TSSOP
RatingCatalog
Schmitt TriggerNo
tpd @ Nom Voltage(Max)(ns)38
VCC(Max)(V)6
Approx. Price (US$)0.12 | 1ku
VCC(Min)(V)2
Output Drive (IOL/IOH)(Max)(mA)7.8/-7.8
  Mecanical Data
Pin nbPackage typeInd stdJEDEC codePackage qtyCarrierDevice markWidth (mm)Length (mm)Thick (mm)Pitch (mm)
20DWSOICR-PDSO-G25TUBEHC574 7.512.82.351.27

 

Features, Applications
SN54HC574, SN74HC574 OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS

Wide Operating Voltage Range 6 V High-Current 3-State Noninverting Outputs Drive Bus Lines Directly To 15 LSTTL Loads Low Power Consumption, 80-A Max ICC Typical tpd ns 6-mA Output Drive 5 V Low Input Current 1 A Max Bus-Structured Pinout

These octal edge-triggered D-type flip-flops feature 3-state outputs designed specifically for bus driving. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. The eight flip-flops enter data on the low-to-high transition of the clock (CLK) input. A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without interface or pullup components. ORDERING INFORMATION

TA PDIP N SOIC to 85C SSOP DB SOP NS TSSOP PW CDIP to 125C CFP W LCCC FK PACKAGE Tube of 20 Tube of 25 Reel of 2000 Reel of 2000 Reel of 2000 Tube of 70 Reel of 2000 Reel of 250 Tube of 20 Tube of 85 Tube of 55

SNJ54HC574FK Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

OE does not affect the internal operations of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

FUNCTION TABLE (each flip-flop) INPUTS OE CLK H or OUTPUT Q0 Z
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)

Supply voltage range, VCC. 7 V Input clamp current, IIK (VI VI > VCC) (see Note 20 mA Output clamp current, IOK (VO VO > VCC) (see Note 20 mA Continuous output current, IO (VO 0 to VCC). 35 mA Continuous current through VCC or GND. 70 mA Package thermal impedance, JA (see Note 2): DB package. 70C/W DW package. 58C/W N package. 69C/W NS package. 60C/W PW package. 83C/W Storage temperature range, Tstg. to 150C

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-7.

SN54HC574 MIN VCC VIH Supply voltage High-level input voltage VCC 2 V VCC 4.5 V VCC 6 V VCC 2 V VIL VI VO t/v Low-level input voltage Input voltage Output voltage Input transition rise/fall time VCC 2 V VCC 4.5 V VCC 4.5 V VCC 6 V VCC NOM 5 MAX 6 SN74HC574 MIN VCC 500 ns NOM 5 MAX 6 UNIT V

VCC 400 TA Operating free-air temperature C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

electrical characteristics over recommended operating free-air temperature range (unless otherwise noted)


 

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