Details, datasheet, quote on part number: MAX8796GTJ+
DescriptionPlastic Encapsulated Devices
CompanyMaxim Integrated Products
DatasheetDownload MAX8796GTJ+ datasheet
Cross ref.Similar parts: TPS51120
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Features, Applications

Approved by Ken Wendel Quality Assurance Director, Reliability Engineering

MAX8796GTJ+ Conclusion The MAX8796GTJ+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.

Table of Contents I........Device Description II........Manufacturing Information III.......Packaging Information.....Attachments I. Device Description A. General na V........Quality Assurance Information VI.......Reliability Evaluation IV.......Die Information

MAX8796GTJ+ II. Manufacturing Information A. Description/Function: B. Process: C. Number of Device Transistors: D. Fabrication Location: E. Assembly Location: F. Date of Initial Production: III. Packaging Information A. Package Type: B. Lead Frame: C. Lead Finish: D. Die Attach: E. Bondwire: F. Mold Material: G. Assembly Diagram: H. Flammability Rating: I. Classification of Moisture Sensitivity per JEDEC standard J-STD-020-C J. Single Layer Theta Ja: K. Single Layer Theta Jc: L. Multi Layer Theta Ja: M. Multi Layer Theta Jc: IV. Die Information A. Dimensions: B. Passivation: C. Interconnect: D. Backside Metallization: E. Minimum Metal Width: F. Minimum Metal Spacing: G. Bondpad Dimensions: H. Isolation Dielectric: I. Die Separation Method: X 73 mils Si3N4/SiO2 (Silicon nitride/ Silicon dioxide Aluminum/Si (Si = 1%) None = 0.6 microns (as drawn) = 0.6 microns (as drawn) 5 mil. Sq. SiO2 Wafer Saw 32-pin TQFN 5x5 Copper 100% matte Tin Conductive Epoxy Gold (1 mil dia.) Epoxy with silica filler #05-9000-2634 Class UL94-V0 Level 29°C/W 2.7°C/W Single-Phase Quick-PWM Intel IMVP6/6+/GMCH Controller S4 10146 Texas UTL Thailand December 19, 2007


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