Details, datasheet, quote on part number: GM76C256CL-W
PartGM76C256CL-W
CategoryMemory => SRAM => Low Power => 256 Kb
Description
CompanyHynix Semiconductor
DatasheetDownload GM76C256CL-W datasheet
  

 

Features, Applications

Revision No 00 History Revision History Insert Revised - Datasheet format change - PDIP package type insert - Pin configuration change Marking Information Add Revised - AC Test Condition Add : 5pF Test Load - tCLZ Value Change 10ns - tOLZ Value Change > 5ns Changed Logo - HYUNDAI hynix Draft Date Jul.07.2000 Remark Final

This document is a general product description and is subject to change without notice. Hynix Electronics does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 02 / Apr. 2001 Hynix Semiconductor

DESCRIPTION

The is a high-speed, low power and X 8-bits CMOS Static Random Access Memory fabricated using Hynix's high performance CMOS process technology. It is suitable for use in low voltage operation and battery back-up application. This device has a data retention mode that guarantees data to remain valid at the minimum power supply voltage of 2.0 volt.

FEATURES

Fully static operation and Tri-state output TTL compatible inputs and outputs Low power consumption Battery backup(L/LL-part) - 2.0V(min.) data retention Standard pin configuration - 28 pin 600mil PDIP - 28 pin 330mil SOP - 28 pin 8x13.4 mm TSOP-I (Standard) Standby Current(uA) L LL Temperature (°C) 0~70(Normal)

Pin Name /CS /WE /OE ~ I/O8 Vcc Vss Pin Function Chip Select Write Enable Output Enable Address Inputs Data Input/Output Power(+5.0V) Ground

SENSE AMP ROW DECODER ADD INPUT BUFFER I/O1 OUTPUT BUFFER I/O8

Part No. GM76C256CLT-W GM76C256CLLT-W Speed Power L-part LL-part L-part LL-part L-part LL-part Temp to 70°C Package PDIP SOP TSOP-I Standard TSOP-I Standard

Symbol Parameter Rating Unit Vcc, VIN, VOUT Power Supply, Input/Output Voltage V TA Operating Temperature 70 °C TSTG Storage Temperature °C PD Power Dissipation 1.0 W IOUT Data Output Current 50 mA TSOLDER Lead Soldering Temperature & Time 26010 °Csec Note 1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is stress rating only and the functional operation of the device under these or any other conditions above those indicated in the operation of this specification is not implied. Exposure to the absolute maximum rating conditions for extended period may affect reliability.

Vcc Power Supply Voltage Vss Ground VIH Input High Voltage VIL Input Low Voltage Note 1. VIL = -3.0V for pulse width less than 50ns

/CS /WE /OE Mode H X Standby L H Output Disabled H L Read L X Write Note 1. H=VIH, L=VIL, X=Don't Care I/O Operation High-Z Data Out Data In


 

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