|Datasheet||Download 2SB1407S datasheet
Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp.
The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog and discrete devices, and memory chips other than DRAMs (flash memory, SRAMs etc.) Accordingly, although Hitachi, Ltd., Hitachi Semiconductors, and other Hitachi brand names are mentioned in the document, these names have in fact all been changed to Renesas Technology Corp. Thank you for your understanding. Except for our corporate trademark, logo and corporate statement, no changes whatsoever have been made to the contents of the document, and these changes do not constitute any alteration to the contents of the document itself. Renesas Technology Home Page: http://www.renesas.comRenesas Technology Corp. Customer Support Dept. April 1, 2003
Keep safety first in your circuit designs! 1. Renesas Technology Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corporation product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corporation or a third party. 2. Renesas Technology Corporation assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corporation without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corporation assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corporation by various means, including the Renesas Technology Corporation Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corporation assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corporation semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corporation or an authorized Renesas Technology Corporation product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corporation is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corporation for further details on these materials or the products contained therein.Low frequency power amplifier complementary Pair with 2SD2121(L)/(S)
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MC74VHCT245A : Bus Oriented Circuits. Octal Bus Transceiver (ttl Compatible). The is an advanced high speed CMOS octal bus transceiver fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TTL while maintaining CMOS low power dissipation. It is intended for twoway asynchronous communication between data buses. The direction of data transmission is determined by the level.
40HF600 : Standard Recovery Diodes. High surge current capability Stud cathode and stud anode version Leaded version available Types to 1600V VRRM Typical Applications Battery charges Converters Power supplies Machine tool controls Welding Voltage Type number Code VRRM, maximum repetitive peak reverse voltage V VRSM, maximum nonrepetitive peak reverse voltage V I F(AV) Max. average forward.
54AC00 : Rad-Hard AC/ACT: 5V Advanced High Speed CMOS Rad-Hard advanced high speed 5 V CMOS logic series.
0460-202-16141. : CRIMP CONTACT, PIN, 20-16AWG, CRIMP. s: Series: - ; For Use With: DT Series Connectors ; Wire Size (AWG): 20-16 ; Contact Termination: Crimp ; Contact Gender: Pin ; Contact Size: 16 ; Contact Material: Copper Alloy ; Contact Plating: Nickel.
EEU-TA1J331S : 330µF Aluminum Capacitor Radial, Can 63V; CAP ALUM 330UF 63V 20% RADIAL. s: Capacitance: 330µF ; ESR (Equivalent Series Resistance): - ; : General Purpose ; Lifetime @ Temp.: 2000 Hrs @ 125°C ; Size / Dimension: 0.709" Dia (18.00mm) ; Lead Spacing: 0.295" (7.50mm) ; Surface Mount Land Size: - ; Mounting Type: Through Hole ; Package / Case: Radial, Can ; Packaging:.
OSTOQ077551 : Through Hole Terminal Block - Headers, Plug And Socket Connectors, Interconnect Header, Male Pins, Shrouded (4 Side); CONN HEADER 7POS 5.0MM R/A PCB. s: Terminal Block Type: Header, Male Pins, Shrouded (4 Side) ; Positions Per Level: 7 ; Pitch: 0.197" (5.00mm) ; Number of Levels: 1 ; Header Orientation: 90°, Right Angle ; Plug Wire Entry: - ; Termination:.
XAM1707BZKB4 : Embedded - Microprocessor Integrated Circuit (ics) ARM Microprocessor Tray 1.25 V ~ 1.35 V; IC ARM PROCESSOR 256BGA. s: Processor Type: ARM Microprocessor ; Speed: 456MHz ; Voltage: 1.25 V ~ 1.35 V ; : - ; Package / Case: 256-BGA ; Packaging: Tray ; Lead Free Status: Lead Free ; RoHS Status: RoHS Compliant.
1-640622-5 : Tin-Lead Free Hanging (In-Line) Rectangular - Free Hanging, Panel Mount Connectors, Interconnect Receptacle; CONN RECEPT 15POS MTA-100 26AWG. s: Color: Blue ; Connector Type: Receptacle ; Contact Finish: Tin-Lead ; : Feed Through ; Mounting Type: Free Hanging (In-Line) ; Number of Rows: 1 ; Pitch: 0.100" (2.54mm) ; Row Spacing: - ; Packaging: Bulk ; Fastening.
2-1612163-1 : Gold Through Hole Card Edge, Edgeboard Connector Connectors, Interconnect PCI Express™; PCI EXPR CONN 1X 36P 0.38U 2.3MM. s: Card Thickness: 0.062" (1.57mm) ; Card Type: PCI Express™ ; Contact Finish: Gold ; Mounting Type: Through Hole ; : Board Guide, Locking Ramp ; Number of Positions: 36 ; Number of Rows: 2 ; Pitch: 0.039" (1.00mm) ; Packaging: Bulk.
5554923-2 : Gold Panel Mount; Through Hole, Right Angle D-shaped, Centronic Connectors, Interconnect Receptacle; RCPT ASSY,SHLD,RTANG, 24 POSN. s: Connector Type: Receptacle ; Contact Finish: Gold ; Contact Finish Thickness: Flash ; : Board Lock, Shielded ; Flange Feature: Insert, Threaded (6-32) ; Mounting Type: Panel Mount; Through Hole, Right Angle ; Number.
MCT06030D2322BP100 : 23.2K Ohm 0.1W, 1/10W Chip Resistor - Surface Mount; RES 23.2K OHM 1/10W .1% SMD 0603. s: Resistance (Ohms): 23.2K ; Power (Watts): 0.1W, 1/10W ; Tolerance: ±0.1% ; Packaging: Tape & Reel (TR) ; Composition: Thin Film ; Temperature Coefficient: ±25ppm/°C ; Lead Free Status: Lead Free ; RoHS Status: RoHS Compliant.
EXB-A10P473J : Resistor 47K Ohm 62.5mW 8 Resistors[number of pins] Pin Networks, Arrays; RES ARRAY 47K OHM 8 RES 2512. s: Resistance (Ohms): 47K ; Tolerance: ±5% ; Power Per Element: 62.5mW ; Circuit Type: Bussed ; Number of Pins: 10 ; Packaging: Digi-Reel® ; Number of Resistors: 8 ; Package / Case: 2512 (6431 Metric), Concave ; Mounting Type: Surface Mount ; Temperature.
DDME50PL : Gold Panel Mount; Through Hole, Right Angle D-sub Connectors, Interconnect Plug, Male Pins; DSUB 50 M CLIN. s: Connector Type: Plug, Male Pins ; Contact Finish: Gold ; : - ; Flange Feature: Board Side (4-40) ; Mounting Type: Panel Mount; Through Hole, Right Angle ; Number of Positions: 50 ; Number of Rows: 3 ; Termination: Solder ; Contact Finish Thickness:.
TMPG06-18-E3/54 : Tv - Diode Circuit Protection 14.5V 400W; TVS 400W 18V 10% AXIAL. s: Package / Case: MPG06, Axial ; Packaging: Tape & Reel (TR) ; Polarization: Unidirectional ; Power (Watts): 400W ; Voltage - Reverse Standoff (Typ): 14.5V ; Voltage - Breakdown: 16.2V ; Lead Free Status: Lead Free ; RoHS Status: RoHS Compliant.
3FGA192-720G : BGA192, IC SOCKET. s: Product Type: IC Socket ; RoHS Compliant: RoHS Compliant ; Socket Type: BGA ; Contact Plating: Gold ; Number of Contacts: 192.